Stock material or miscellaneous articles – Composite – Of bituminous or tarry residue
Patent
1991-01-28
1992-09-15
Hille, Rolf
Stock material or miscellaneous articles
Composite
Of bituminous or tarry residue
428607, 357 70, H01L 2354
Patent
active
051482614
ABSTRACT:
A contact member for thermocompression bonding in integrated circuit packaging has on a conductor end a uniform texture deformable layer with a hardness value in the range of that of soft gold which is approximately 90 on the Knoop scale and with a rough surface morphology having ridges with approximately 1 micrometer modulation frequency and a depth between ridges of from 1/4 to 1/2 that of the average integrated circuit pad. The deformable layer is produced by plating gold in a strong electronegative plating bath within a range of 0.03 to 0.05 mA/sq.mm. current density. Plating apparatus, for plating different areas, with different electronegative conditions, with separate independently powered anodes, is provided.
REFERENCES:
patent: 3873428 (1975-03-01), Winters
patent: 4096983 (1978-06-01), Beilein et al.
patent: 4188438 (1980-02-01), Burns
patent: 4263606 (1981-04-01), Yorikane
patent: 4572924 (1986-02-01), Wakely et al.
patent: 4862322 (1989-08-01), Bickford et al.
patent: 5006917 (1991-04-01), Kang et al.
Microelectronics Packaging Handbook edited by Rao R. Tummala and Eugene J. Rymaszewski, Van Nostrand (1989), pp. 409-431.
Br. Telecom. Technol. J. vol. 3, No. 3, Jul. 1985, pp. 86-92, "Tape Automated Bonding" by Small et al.
IBM Technical Disclosure Bulletin, vol. 30, No. 7, Dec. 1987, pp. 208-209, "High Strength Thermocompression Bonds" by Bickford et al.
Plating Magazine, Jul. 1973, pp. 715-719, "The Strength and Ductility of Some Gold Electrodeposits" by Deuber et al.
Metal Finishing Guidebook, vol. 83, No. 1A, "Gold Plating" by A. M. Weisberg, Metals & Plastics Pub. Inc. Hackensack, N.J. 1985, pp. 232-234.
Kang Sung K.
Palmer Michael J.
Reiley Timothy C.
Topa Robert D.
Clark S. V.
Hille Rolf
International Business Machines - Corporation
Morris Daniel P.
Riddles Alvin J.
LandOfFree
Thermocompression bonding in integrated circuit packaging does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with Thermocompression bonding in integrated circuit packaging, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Thermocompression bonding in integrated circuit packaging will most certainly appreciate the feedback.
Profile ID: LFUS-PAI-O-740602