Process for improving the adhesion of hot melts to metal substra

Details Process for improving the adhesion of hot melts to metal substra Process for improving the adhesion of hot melts to metal substra

1976-06-21

1977-10-11

Kendall, Ralph S.

Stock material or miscellaneous articles

Composite

Of metal

428480, 427388B, 427409, B32B 1508

Patent

active

040536823

ABSTRACT:
Adhesion of filled poly(ester-amide) adhesive compositions to metal substrates is improved by priming the metal substrate with a tie coat of an etherified methylolmelamine prior to application of the filled poly(ester-amide). The etherified methylolmelamine is the condensation product of melamine, formaldehyde and an alkanol or cycloalkanol in which the degree of methylolation is in the range of about 5 to 6, the degree of etherification is in the range of about 3 to 6 and the degree of methylation is at least about 2.

REFERENCES:
patent: 3650999 (1972-03-01), Martins et al.
patent: 3849514 (1976-11-01), Gray et al.
patent: 3877998 (1975-04-01), Guhde

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