Fishing – trapping – and vermin destroying
Patent
1994-02-22
1995-07-25
Chaudhuri, Olik
Fishing, trapping, and vermin destroying
437 47, 437 60, 437919, H01L 2170, H01L 2700
Patent
active
054361877
ABSTRACT:
A process for fabricating a semiconductor device having a capacitor is disclosed. The process comprises the steps of: providing a semiconductor substrate having a transistor formed therein; forming an interlayer insulating film over a surface of the semiconductor substrate; forming in sequence a first polysilicon film and a first insulating film on a surface of the interlayer insulating film; selectively removing the first insulating film and the first polysilicon film to define a core made of the first insulating film and a bottom electrode made of the first polysilicon film; forming in sequence an undoped second polysilicon film and a second insulating film over the core and the bottom electrode; selectively removing the second insulating film to leave a part of the second insulating film, the part of the second insulating film serving as a cylindrical spacer which surrounds sidewalls of the core and the bottom electrode with intervention of the second polysilicon film; selectively removing a portion the second polysilicon film using the cylindrical spacer as a mask to form an undoped-polysilicon-film spacer interposed between the core and the cylindrical spacer; removing the cylindrical spacer and the core with leaving the bottom electrode and the undoped-polysilicon-film spacer; and introducing an impurity into the undoped-polysilicon-film spacer to form a cylindrical electrode, and to form a storage node electrode comprising the cylindrical electrode and the bottom electrode, the storage node electrode serves as one electrode of the capacitor.
REFERENCES:
patent: 4974040 (1990-11-01), Taguchi et al.
patent: 5140389 (1992-08-01), Kimura et al.
patent: 5150276 (1992-09-01), Gonzalez et al.
patent: 5185282 (1993-02-01), Lee et al.
patent: 5223448 (1993-06-01), Su
patent: 5266512 (1993-11-01), Kirsch
Chaudhuri Olik
NEC Corporation
Tsai H. Jey
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