Method and apparatus for selectively applying solder paste to mu

Details Method and apparatus for selectively applying solder paste to mu Method and apparatus for selectively applying solder paste to mu

1992-07-27

1995-07-25

Beck, Shrive

Coating processes

Electrical product produced

Integrated circuit, printed circuit, or circuit board

427282, B05D 100

Patent

active

054360285

ABSTRACT:
A single screen printer (200) holds at least two solder stencils (225). The screen printer (200) receives a printed circuit board (105) and determines a printed circuit board configuration. When the printed circuit board (105) is of a first configuration, the printed circuit board (105) is aligned with a first stencil (225) and solder paste is selectively applied to the printed circuit board (105) through the first stencil (225). When the printed circuit board (105) is of a second configuration, the printed circuit board is aligned with a second stencil (225) through which solder paste is selectively applied to the printed circuit board (105).

REFERENCES:
patent: 4604966 (1986-08-01), Kohn
patent: 4636406 (1987-01-01), Leicht
patent: 4789096 (1988-12-01), Dunn
patent: 4919969 (1990-04-01), Walker
patent: 5001829 (1991-03-01), Schelhorn
patent: 5107759 (1992-04-01), Omori
patent: 5118027 (1992-06-01), Braun
patent: 5232736 (1993-08-01), Tribbey

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