Method for producing a semiconductor device

Fishing – trapping – and vermin destroying

Patent

Rate now

  [ 0.00 ] – not rated yet Voters 0   Comments 0

Details

437133, 437912, 437944, 1566611, 148DIG110, H01L 21283, H01L 21312

Patent

active

053690443

ABSTRACT:
A method for producing a field effect transistor including a layer in which a two-dimensional electron gas is formed includes forming source and drain electrodes spaced from each other on a substrate structure including the layer in which a two-dimensional electron gas is formed. First and second resist films are sequentially applied to the structure and a stripe-shaped first opening is formed in the second resist film between the source and drain electrodes and extending in a longitudinal direction, perpendicular to a line connecting the source and drain electrodes. A plurality of second openings narrower than the first opening are formed within the first resist film in the first opening. The second openings are arranged at intervals along the longitudinal direction of the first opening. The second openings may be used as an etching mask to form recesses in the substrate structure not reaching the layer in which the two-dimensional electron gas is formed. A gate electrode is formed by depositing a gate metal on the remaining parts of the first and second resist films and in the second openings followed by lifting off unneeded parts of the gate metal and the first and second resist films.

REFERENCES:
patent: 4463366 (1984-07-01), Ishii et al.
patent: 4583107 (1986-05-01), Clarke
patent: 4796068 (1989-01-01), Katayama et al.
patent: 5006478 (1991-04-01), Kobayashi et al.
patent: 5053348 (1991-10-01), Mishra et al.
patent: 5057883 (1991-10-01), Noda
Onda et al., "Striped Channel Field Effect Transistors With A Modulation Doped Structure", IEEE International Electron Devices Meeting, Dec. 1989, pp. 5.8.2-5.8.4.
Eugster et al., "Criteria For One-Dimensional Transport In Split-Gate Field Effect Transistors", IEEE International Electron Devices Meeting, Dec. 1989, pp. 13.4.1-13.4.4.

LandOfFree

Say what you really think

Search LandOfFree.com for the USA inventors and patents. Rate them and share your experience with other people.

Rating

Method for producing a semiconductor device does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Method for producing a semiconductor device, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Method for producing a semiconductor device will most certainly appreciate the feedback.

Rate now

     

Profile ID: LFUS-PAI-O-73765

  Search
All data on this website is collected from public sources. Our data reflects the most accurate information available at the time of publication.