Molded-in lead frames

Details Molded-in lead frames Molded-in lead frames

1993-05-20

1995-08-01

Thompson, Gregory D.

Electricity: electrical systems and devices

Housing or mounting assemblies with diverse electrical...

For electronic systems and devices

439 70, H05K 502

Patent

active

054384818

ABSTRACT:
The disclosure features lead frames, molded lead frames and adapters and sockets produced by molding these lead frames. In general, the lead frames comprise a frame and a circuit, wherein the circuit comprises a plurality of electrical conducting elements. The elements are held in position by the frame, and each element comprises an area within the element suitable for positioning a pin through the element to electrically connect the element with the board. The lead frame can be molded in plastic and trimmed to remove the frame to leave each element electrically separate from each other element.

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