Electricity: electrical systems and devices – Housing or mounting assemblies with diverse electrical... – For electronic systems and devices
Patent
1993-08-12
1995-08-01
Thompson, Gregory D.
Electricity: electrical systems and devices
Housing or mounting assemblies with diverse electrical...
For electronic systems and devices
165 803, 165185, 257713, 257714, 257719, 361690, 2989003, H05K 720
Patent
active
054384770
ABSTRACT:
A technique for forming bump bonded semiconductor device assemblies is described wherein a die attach structure is disposed between a semiconductor die and a substrate. Bump bonds (conductive bump contacts) are formed between the die and the substrate, outside of the periphery of the die attach structure. The die attach structure has a "rippled" or egg-crate shaped shape or texture characterized by alternating positive and negative peaks. The die is attached (e.g., by an adhesive) to the positive peaks, and the substrate is attached to the negative peaks. The die attach has the effect of anchoring the die to the substrate and absorbing mechanical shocks which would otherwise be transmitted to the conductive bump contacts. This serves to improve the shock resistance of the chip/substrate assembly. The die attach structure can be made to match the coefficient of expansion of the bump bonds as well as that of the die.
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LSI Logic Corporation
Thompson Gregory D.
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