Method for producing multi-layer ceramic substrates with oxidati

Adhesive bonding and miscellaneous chemical manufacture – Methods – Surface bonding and/or assembly therefor

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264 61, 264 63, C04B 3700

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active

051474840

ABSTRACT:
Ceramic substrates and a method for forming the ceramic substrates containing multi-level and interconnected circuit patterns of copper based conductors which are resistant to oxidation, said formation includes burn-out of binders in air. The oxidation resistant copper based conductors are composed primarily of copper and additives such as zinc, platinum and chrome.

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"Prevention of Corrosion of Copper by Ion Implantation", B. L. Crowder et al. IBM TDB vol. 14, No. 1, Jun. 1971, p. 198.

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