Semiconductor device and method of manufacturing semiconductor d

Details Semiconductor device and method of manufacturing semiconductor d Semiconductor device and method of manufacturing semiconductor d

1998-04-14

2000-03-21

Saadat, Mahshid

Active solid-state devices (e.g., transistors, solid-state diode

Combined with electrical contact or lead

Of specified material other than unalloyed aluminum

257750, 257751, 257758, 257774, H01L 2348, H01L 2352, H01L 2940

Patent

active

060406275

ABSTRACT:
A semiconductor device is formed with interconnections having reduced electric resistance. The semiconductor device comprises an upper wiring formed on an insulating film with a barrier metal therebetween, a conductive plug formed in a plugging space of the insulating film and electrically connected to the upper wiring at an opening of the plugging space, and a sidewall formed on a side surface of the upper wiring, the bottom of the sidewall covering the opening of the plugging space not covered by the upper wiring.

REFERENCES:
patent: 5061646 (1991-10-01), Sivan et al.
patent: 5243220 (1993-09-01), Shibata et al.
patent: 5371410 (1994-12-01), Chen et al.
patent: 5545590 (1996-08-01), Licata
patent: 5652182 (1997-07-01), Cleeves
patent: 5656543 (1997-08-01), Chung
patent: 5872053 (1999-02-01), Smith

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