Surface acoustic wave device with improved junction bonding and

Details Surface acoustic wave device with improved junction bonding and Surface acoustic wave device with improved junction bonding and

1991-11-04

1994-01-25

Budd, Mark O.

Electrical generator or motor structure

Non-dynamoelectric

Piezoelectric elements and devices

310313B, H01L 4108

Patent

active

052818837

ABSTRACT:
A surface acoustic wave device in which a surface acoustic wave device element is arranged with interdigital electrodes on a piezoelectric substrate is packaged in a package provided in a metal pattern. Metal bumps are formed on a bonding pad section of the surface wave device element and the metal bumps are contact connected with the metal pattern of the package.

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