Soldering apparatus for providing a fixed quantity of solder pie

Details Soldering apparatus for providing a fixed quantity of solder pie Soldering apparatus for providing a fixed quantity of solder pie

1997-02-05

1999-09-21

Ryan, Patrick

Metal fusion bonding

Process

Preplacing solid filler

228 41, 228244, 22818021, 228 563, H01R 402

Patent

active

059542624

ABSTRACT:
A punching pin of a soldering apparatus cuts out a solder piece from a solder plate onto a feeder pin, and the feeder pin presses the solder piece against a predetermined junction of a conductive wiring pattern incorporated in a printed circuit board; then, an electric circuit component is mounted on the printed circuit board, and is strongly soldered to the conductive wiring pattern, because the punching pin and the feeder pin supply a fixed amount of solder to the predetermined junction.

REFERENCES:
patent: 5372295 (1994-12-01), Abe et al.
patent: 5508561 (1996-04-01), Tago et al.

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