Energy beam curable hydrophilic pressure sensitive adhesive comp

Details Energy beam curable hydrophilic pressure sensitive adhesive comp Energy beam curable hydrophilic pressure sensitive adhesive comp

1998-08-27

2000-03-21

Seidleck, James J.

Stock material or miscellaneous articles

Web or sheet containing structurally defined element or...

Adhesive outermost layer

427517, 4272084, 522120, 522121, 522 95, 428343, 428355R, 428355AC, B32B 712

Patent

active

06040048&

ABSTRACT:
An energy beam curable hydrophilic pressure sensitive adhesive composition comprising a hydrophilic pressure sensitive adhesive (A) and an energy beam polymerizable compound (B), optionally together with a photopolymerization initiator (C) added according to necessity. Thus, a pressure sensitive adhesive composition suitable for use in a wafer surface protective sheet is provided, which enables easy removal of any residual pressure sensitive adhesive by washing with water, even if the pressure sensitive adhesive remains on the wafer surface after peeling of the pressure sensitive adhesive sheet.

REFERENCES:
patent: 4312916 (1982-01-01), Kakumara et al.
patent: 5149586 (1992-09-01), Ishiwata et al.
patent: 5278199 (1994-01-01), Ohkawa et al.
patent: 5281473 (1994-01-01), Ishiwata et al.
patent: 5302629 (1994-04-01), Berejka
patent: 5360873 (1994-11-01), Ohkawa et al.

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