Method of forming a film having enhanced reflow characteristics

Coating processes – Direct application of electrical – magnetic – wave – or... – Pretreatment of substrate or post-treatment of coated substrate

Patent

Rate now

  [ 0.00 ] – not rated yet Voters 0   Comments 0

Details

4272495, 427250, 42725518, 42725521, 4273762, 427527, 427531, B32B 1700

Patent

active

06040020&

ABSTRACT:
A method of forming a film having enhanced reflow characteristics at low thermal budget is disclosed, in which a surface layer of material is formed above a base layer of material, the surface layer having a lower melting point than the base layer. In this way, a composite film having two layers is created. After reflow, the surface layer can be removed using conventional methods.

REFERENCES:
patent: 4474831 (1984-10-01), Downey
patent: 5284800 (1994-02-01), Lien
patent: 5474955 (1995-12-01), Thakur
patent: 5783493 (1998-07-01), Yeh
patent: 5789317 (1998-08-01), Batra
patent: 5885896 (1999-03-01), Thakur

LandOfFree

Say what you really think

Search LandOfFree.com for the USA inventors and patents. Rate them and share your experience with other people.

Rating

Method of forming a film having enhanced reflow characteristics does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Method of forming a film having enhanced reflow characteristics , we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Method of forming a film having enhanced reflow characteristics will most certainly appreciate the feedback.

Rate now

     

Profile ID: LFUS-PAI-O-728462

  Search
All data on this website is collected from public sources. Our data reflects the most accurate information available at the time of publication.