Electroless bismuth plating bath

Details Electroless bismuth plating bath Electroless bismuth plating bath

1994-02-03

1994-11-29

Klemanski, Helene

Coating processes

Immersion or partial immersion

Chemical compound reducing agent utilized

427437, B05D 118

Patent

active

053688961

ABSTRACT:
In an electroless plating bath containing bismuth trichloride, a reducing agent and complexing agents, stannous chloride is employed as the reducing agent to enable electroless plating of bismuth, which has generally been regarded as impossible. A preferable composition of the plating bath is 0.08M of bismuth trichloride, 0.34M of sodium citrate, 0.08M of EDTA, 0.20M of nitrilotriacetic acid, and 0.04M of stannous chloride. In plating treatment, the plating bath preferably has a temperature of 60.degree. C. and a pH value of 8.6 to 8.8.

REFERENCES:
patent: 3323938 (1967-06-01), Vaught
patent: 3947610 (1976-03-01), Bodmer et al.

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