Method for forming a multilayer printed circuit board

Details Method for forming a multilayer printed circuit board Method for forming a multilayer printed circuit board

1976-03-30

1977-06-21

DiPalma, Victor A.

Metal working

Method of mechanical manufacture

Electrical device making

29628, 174 685, 204 15, 427 97, 427 98, B41M 308, H05K 308, H05K 336

Patent

active

040301907

ABSTRACT:
Multilayer printed circuit boards are formed by providing a plurality of board assemblies having appropriate ground, signal and voltage planes. Each assembly is built around a dimensionally stable core to enhance registration between levels and is processed in such a manner that there exists a relative dimensionally stable configuration when performing method steps important to maintain good registration. The assemblies may constitute a completed multilayer board or may be subsequently combined to provide a more complex multilayer printed circuit board.

REFERENCES:
patent: 3508330 (1970-04-01), Kubik
patent: 3509624 (1970-05-01), Boucher
patent: 3554877 (1971-01-01), Geisler
patent: 3756891 (1973-09-01), Ryan
patent: 3764436 (1973-10-01), Schmidt et al.
patent: 3791858 (1974-02-01), McPherson et al.
patent: 3799816 (1974-03-01), Schneble et al.
patent: 3851382 (1974-12-01), Stork
patent: 3867759 (1975-02-01), Siefker
patent: 3913223 (1975-10-01), Gigoux

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