Electrochemical surface preparation for improving the adhesive p

Details Electrochemical surface preparation for improving the adhesive p Electrochemical surface preparation for improving the adhesive p

1984-11-13

1985-10-29

Tufariello, T. M.

Chemistry: electrical and wave energy

Processes and products

204 28, 204 321, 204 351, 204 40, 204207, C25D 510, C25D 534, C25D 548, C25D 1700

Patent

active

045499411

ABSTRACT:
The present invention relates to a treatment for improving the adhesive properties of metallic foils to be used in electrical and electronic applications. The treatment of the present invention comprises applying a light substantially uniform layer of metal to at least one surface of the metallic foil just prior to the formation of a plurality of dendritic structures on the surface. The metal layer renders the surface or surfaces to be treated more uniformly electrochemically active and consequently more receptive to the subsequent dendritic treatment. The treatment of the present invention has particular utility in improving the adhesive properties of wrought copper and copper alloy foils. An apparatus for performing the present treatment is also described.

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Technologien und Spezialausrustungen zur Erzeugung und Nachbehandlung von Kupferfolien by W. Burkhart, Metall., Aug. 1978, pp. 791-793.

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