Method of assembling a hermetically sealed semiconductor unit

Details Method of assembling a hermetically sealed semiconductor unit Method of assembling a hermetically sealed semiconductor unit

1976-12-20

1979-02-27

James, Andrew J.

357 67, 357 74, 357 72, 357 73, H01L 3902, H01L 2348, H01L 2944

Patent

active

041422031

ABSTRACT:
Hermetically sealed unit containing an integrated circuit metal oxide semi-conductor chip, wherein a single layer gold-silver alloy serves both to secure the chip within the unit and to form a proper junction with the aluminum alloy conductor connected to a circuit element in said chip. A sufficient proportion of silver is included in the gold-silver alloy whereby said junction retains requisite operational characteristics of bond strength and low resistivity when said unit is subjected to heat for providing a hermetic seal therefor.

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patent: 3593412 (1971-07-01), Foote
patent: 3617819 (1971-11-01), Boisvert
patent: 3622419 (1971-11-01), London
patent: 3691289 (1972-09-01), Rohloff
patent: 3793064 (1974-02-01), Budd et al.
patent: 4024567 (1977-05-01), Iwata et al.
patent: 4027236 (1977-05-01), Kummer et al.

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