Ink jet heater chip module

Incremental printing of symbolic information – Ink jet – Ejector mechanism

Patent

Rate now

  [ 0.00 ] – not rated yet Voters 0   Comments 0

Details

B41J 205

Patent

active

060394390

ABSTRACT:
A heater chip module is provided comprising a carrier adapted to be secured to an ink-filled container, at least one heater chip having a base coupled to the carrier, and at least one nozzle plate coupled to the heater chip. The carrier includes a support substrate having at least one passage which defines a path for ink to travel from the container to the heater chip. The heater chip is secured at its base to a portion of the support substrate. At least the portion of the support substrate is formed from a material having substantially the same coefficient of thermal expansion as the heater chip base. A flexible circuit is coupled to the heater chip module such as by TAB bonding or wire bonding.

REFERENCES:
patent: 4169008 (1979-09-01), Kurth
patent: 4500895 (1985-02-01), Buck
patent: 4558333 (1985-12-01), Sugitami et al.
patent: 4635073 (1987-01-01), Hansen
patent: 4639748 (1987-01-01), Drake et al.
patent: 4663640 (1987-05-01), Ikeda
patent: 4712172 (1987-12-01), Kiyohara
patent: 4786357 (1988-11-01), Campanelli et al.
patent: 4789425 (1988-12-01), Drake et al.
patent: 4791440 (1988-12-01), Eldridge
patent: 4812859 (1989-03-01), Chan
patent: 4881318 (1989-11-01), Komuro
patent: 4942408 (1990-07-01), Braun
patent: 5030971 (1991-07-01), Drake
patent: 5036337 (1991-07-01), Rezanka
patent: 5063655 (1991-11-01), Lamey et al.
patent: 5075250 (1991-12-01), Hawkins et al.
patent: 5113204 (1992-05-01), Miyazawa et al.
patent: 5198054 (1993-03-01), Drake et al.
patent: 5368683 (1994-11-01), Altavela et al.
patent: 5387314 (1995-02-01), Baughman et al.
patent: 5388326 (1995-02-01), Beeson et al.
patent: 5408189 (1995-04-01), Swart et al.
patent: 5408739 (1995-04-01), Altavela et al.
patent: 5434607 (1995-07-01), Keefe
patent: 5441593 (1995-08-01), Baughman et al.
patent: 5450109 (1995-09-01), Hock
patent: 5469199 (1995-11-01), Allen et al.
patent: 5487483 (1996-01-01), Kubby
patent: 5539982 (1996-07-01), Hosono et al.
patent: 5565901 (1996-10-01), Hawkins
patent: 5581861 (1996-12-01), Lee et al.
patent: 5604521 (1997-02-01), Merkel et al.
patent: 5649359 (1997-07-01), Murakami et al.
U. Schnakenberg, W. Benecke, and P. Lange, THAHW Etchants for Silicon Micromachining, In Proc. Int. Conf. on Solid State Sensors and Actuators (Transducers 1991) pp. 815-818, San Francisco, Jun. 1991.
"The Mechanism of Anisotropic, Electrochemical Silicon Etching in Alkaline Solutions" by H. Seidel (Federal Republic of Germany), 1990.
"KOH Etch Rates of High-Index Planes from Mechanically Prepared Silicon Crystals" by E. Herr and H. Baltes (Physical Electronics Laboratory, Zurich, Switzerland), 1991.
"Compensation Structures for Convex Corner Micromachining in Silicon" by B. Puers and W. Sansen (Katholieke Universiteit Lewen, Belgium), 1990.
"Orientation of the Third Kind; The Coming of Age of (110) Silicon" by D.L. Kendall and G.R. de Guel (Elsevier Science Publishers, Amsterdam), 1985.
H.T. Henderson & W. Hsieh, "Micromachining in Semiconductors as an On-Chip Manufacturing Technique for Micro-Electromechanical Systems," Proceedings, ASEE N. Central Spring Mtg, Southfield, MI, Apr. 7, 1989.
"The Mechanism of Anisotropic Silicon Etching and Its Relevance for Micromachining" by H. Seidel (W. Germany), 1987.
"Formation of Silicon Reentrant Cavity Heat Sinks Using Anisotropic Etching & Direct Wafer Bonding", by A. Goyal, R.C. Jaeger, S.H. Bhavnani, C.D. Ellis, N.K. Phadke, M. Azimi-Rashti and J.S. Goodling (IEEE Electron Device Letters, vol. 14, No. 1), 1993.
"Submicron Accuracies in Anisotropic Etched Silicon Piece Parts--A Case Study" by T. L. Poteat, 1985.
Carl Edmond Sullivan, "Micromachined Vias for Ink Jet-Printing"-A Thesis Submitted to the Faculty of the University of Louisville Speed Scientific School, Dept. of Electrical Engineering, first available to the public between Aug. 12, 1996 and Sep. 30, 1996, 83 pages.

LandOfFree

Say what you really think

Search LandOfFree.com for the USA inventors and patents. Rate them and share your experience with other people.

Rating

Ink jet heater chip module does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Ink jet heater chip module, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Ink jet heater chip module will most certainly appreciate the feedback.

Rate now

     

Profile ID: LFUS-PAI-O-724997

  Search
All data on this website is collected from public sources. Our data reflects the most accurate information available at the time of publication.