Plastic molded semiconductor package and method of manufacturing

Details Plastic molded semiconductor package and method of manufacturing Plastic molded semiconductor package and method of manufacturing

1995-06-01

1998-01-20

Niebling, John

Fishing, trapping, and vermin destroying

437183, 437211, H01L 2128, H01L 2156

Patent

active

057100624

ABSTRACT:
A pad electrode is formed on a main surface of a semiconductor chip. A passivation film, which covers a surface portion of the pad electrode, is formed on the main surface of the semiconductor chip. An internal connection conductor is formed on a surface portion of the pad electrode. The semiconductor chip is covered with a molding resin which exposes only a top surface of the internal connection conductor. An external connection conductor is formed on a top surface of the internal connection conductor. The external connection conductor has a substantially flat top surface. Thereby, a plastic molded semiconductor package can be easily mounted on a printed board, and can have improved reliability after being joined on the printed board.

REFERENCES:
patent: 3625837 (1971-12-01), Nelson et al.
patent: 3959874 (1976-06-01), Coucoulas
patent: 4620215 (1986-10-01), Lee
patent: 4784872 (1988-11-01), Moeller et al.
patent: 4942140 (1990-07-01), Ootsuki et al.
patent: 5019673 (1991-05-01), Juskey
patent: 5120678 (1992-06-01), Moore et al.
patent: 5179039 (1993-01-01), Ishida et al.
patent: 5273938 (1993-12-01), Lin et al.
patent: 5302553 (1994-04-01), Abbot et al.
patent: 5504035 (1996-04-01), Rostoker et al.
patent: 5519936 (1996-05-01), Andros et al.
patent: 5565379 (1996-10-01), Baba

Affiliated with

Also associated with

Rating

Plastic molded semiconductor package and method of manufacturing does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Plastic molded semiconductor package and method of manufacturing, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Plastic molded semiconductor package and method of manufacturing will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-724899