Thin film interconnect for multicolor IR/CCD

Details Thin film interconnect for multicolor IR/CCD Thin film interconnect for multicolor IR/CCD

1978-11-17

1980-06-03

Edlow, Martin H.

357 40, 357 45, 357 41, 357 65, 357 24, H01L 2714

Patent

active

042064708

ABSTRACT:
A hybrid mosaic IR/CCD focal plane structure is fabricated using planar thin film interconnects. Rows of detectors are formed on an integrated circuit substrate so that the rows of detectors are adjacent to rows of electrical contacts on the integrated circuit. Contact pads are plated onto the rows of contacts and the regions between adjacent rows of detectors are backfilled with an insulating material. The insulating material is then lapped to expose the contact pads and to form an essentially coplanar surface with the detectors. Thin film interconnects are formed over the coplanar surface between the exposed contact pads and detectors in the adjacent row.

REFERENCES:
patent: 3883437 (1975-05-01), Nummedal
patent: 3965568 (1976-06-01), Gooch
patent: 3996599 (1976-12-01), King
patent: 4093957 (1978-06-01), King
patent: 4106046 (1978-08-01), Nathanson
patent: 4142198 (1979-02-01), Finnila
patent: 4148052 (1979-04-01), Nathanson

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