Methods of manufacturing infra-red detector elements

Metal working – Method of mechanical manufacture – Electrical device making

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29572, 29578, 29583, 29592, H01L 3118

Patent

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040373118

ABSTRACT:
A method of forming in a wafer of infra-red sensitive material a large plurality of infra-red detector elements each comprising a body having a rectangular surface configuration with a pair of low resistance contacts extending on oppositely located curved edges of the body at opposite sides of a sensitive area of the body. A wafer of the infra-red sensitive material is adhered to a supporting body and by a combination of masking, etching and polishing techniques a plurality of elemental body portions of reduced thickness are defined in the wafer having oppositely located curved edges. Thereafter, electrically conductive material is deposited to form the contacts on the surface of each elemental body portion, and finally the elemental body portions and applied contacts are removed from the supporting body.

REFERENCES:
patent: 3673063 (1972-06-01), Wakefield
patent: 3795045 (1974-03-01), Dumas
patent: 3988774 (1976-10-01), Cohen-Solal
"A Method for Testing and Bonding Beam-Lead Devices", by P. Mallery, at Electronic Components Conference, Washington, D.C., May 1970.

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