Microelectronic package comprising metal housing grounded to boa

Details Microelectronic package comprising metal housing grounded to boa Microelectronic package comprising metal housing grounded to boa

1994-01-03

1995-03-14

Picard, Leo P.

Electricity: electrical systems and devices

Housing or mounting assemblies with diverse electrical...

For electronic systems and devices

174 35R, 174 35GC, 257728, 257660, 307 91, 334 85, H05K 900, H01L 2504, H04B 330

Patent

active

053981693

ABSTRACT:
A microelectronic package (10) comprises a printed circuit board (12) enclosed within a metal housing (14) for shielding the board from spurious electromagnetic signals. The housing includes a base (30) having side walls (36). A series of first tabs (42) are formed in the side walls and engage the upper face (16) of the printed circuit board to secure the board within the housing. The side walls also include a series of second tabs (46) that engage the edge (20) of the printed circuit board in contact with the ground plane to enhance grounding of the housing.

REFERENCES:
patent: 4404617 (1983-09-01), Ohyama et al.
patent: 5014160 (1991-05-01), McCoy, Jr.

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