Molded waveguide components having electroless plated thermoplas

Details Molded waveguide components having electroless plated thermoplas Molded waveguide components having electroless plated thermoplas

1992-05-07

1995-03-14

Lee, Benny T.

Wave transmission lines and networks

Long lines

Waveguide type

333248, 29600, 156150, 156292, H01P 312, B32B 3114

Patent

active

053980107

ABSTRACT:
A microwave assembly having molded thermoplastic components that are first assembled into an enclosure, and then electroless copper plated to provide for RF conductivity. Assemblies are made by bonding bare thermoplastic components, after which the bonded assembly is electroless copper plated. The components are made of an injection molding material, polyetherimide, or a high strength, high temperature thermoplastic. The components are assembled using a one component epoxy adhesive, for example. All components are designed to be self locating to aid in assembly. A bonding fixture is used to apply clamping pressure to the components while the adhesive cures. After bonding, the waveguide assembly has its critical flange surfaces finish machined prior to plating.

REFERENCES:
patent: 2822524 (1958-02-01), Williston
patent: 3157847 (1964-11-01), Williams
patent: 3195079 (1965-07-01), Burton et al.
patent: 3337822 (1967-08-01), Hahne

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