Method for manufacturing semiconductor package

Details Method for manufacturing semiconductor package Method for manufacturing semiconductor package

1997-07-09

1999-09-28

Niebling, John F.

Semiconductor device manufacturing: process

Packaging or treatment of packaged semiconductor

Metallic housing or support

438125, 257666, 257673, 257676, H01L 2144, H01L 2148, H01L 2150

Patent

active

059602619

ABSTRACT:
A method for manufacturing a semiconductor package in which production time and cost are reduced and production yield is increased is disclosed, including the steps of: providing a backer having a groove, a cap of the backer, a semiconductor chip having a bonding pad, and a lead frame; coating a binder on an edge portion of the recess of the backer and an edge portion of the cap of the backer; mounting the semiconductor chip on the recess of the backer; forming a conductive material on an edge portion of a lead in the lead frame and contacting the lead having the conductive material thereon with the bonding pad of the semiconductor chip; contacting the backer and the cap; and trimming and forming the lead frame.

REFERENCES:
patent: 4355463 (1982-10-01), Burns
patent: 5073521 (1991-12-01), Braden

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