Preparation of devices that include a thin ceramic layer

Details Preparation of devices that include a thin ceramic layer Preparation of devices that include a thin ceramic layer

1993-01-29

1994-11-29

Silbaugh, Jan H.

Adhesive bonding and miscellaneous chemical manufacture

Methods

Surface bonding and/or assembly therefor

156182, 156242, 264 61, 419 10, 419 38, 419 69, B32B 1800

Patent

active

053686675

ABSTRACT:
A device having a thin ceramic layer therein, is made by preparing a mixture of ceramic particles, a binder, and a plasticizer, and forming the mixture into a ceramic layer. A second layer is placed adjacent to the ceramic layer to form a composite layered structure. The thickness of the composite layered structure is reduced, preferably by rolling, until the ceramic layer portion of the composite layered structure has a preselected small thickness. If desired, the thickness of the ceramic layer can be reduced to an arbitrarily small value by stacking the reduced composite layered structures (or one of the layered structures with another structure) and repeating the reducing operation on the stack. The ceramic layer having the preselected thickness is assembled into a device. Devices that can be prepared by this approach include, for example, multilayer capacitors, solid oxide fuel cells, and solid-electrolyte electrochemical storage cells.

REFERENCES:
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R. Gibson et al., "Advances in MSOFC Systems and Technology," Presented at EPRI/GRI Fuel Cell Workshop, pp. 1-34 (Apr. 29, 1992).

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