Wiring board and a method for producing the same

Details Wiring board and a method for producing the same Wiring board and a method for producing the same

1992-11-18

1995-03-14

Picard, Leo P.

Electricity: conductors and insulators

Conduits, cables or conductors

Preformed panel circuit arrangement

174260, 174266, 174268, 361767, 361772, 361810, 361813, H05K 100

Patent

active

053978641

ABSTRACT:
A wiring board including a plate; at least one conductive strip provided on the plate, the conductive strip having a specified connection position; and an electrically insulating film covering the conductive strip and having a slit extending in a direction crossing the longitudinal direction of the conductive strip. A tip of the conductive strip in the vicinity of the connection position has a distance from the connection position in a longitudinal direction of the conductive strip. The slit is formed at a position corresponding to the connection position.

REFERENCES:
patent: 3614832 (1971-10-01), Chance et al.
patent: 4859808 (1989-08-01), Jeter et al.
patent: 5061988 (1991-10-01), Rector
patent: 5288950 (1994-02-01), Ushio et al.
F. Soga: "Handbook for Semiconductor Mounting," pp. 128-138, Sep. 25, 1986, Flip Chip Bonding w/partial English translation.
Ichikawa et al, Okidenki Research and Development, 138, vol. 55, No. 2, pp. 51-56, Apr. 1988, "Flip-Chip Joining Technique for 400DPI Thermal Printing Heads" w/partial English translation.

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