Quad flat package heat slug composition

Details Quad flat package heat slug composition Quad flat package heat slug composition

1993-11-03

1995-03-14

Hearn, Brian E.

Fishing, trapping, and vermin destroying

437211, 437214, 437217, 437218, 437219, H01L 2160

Patent

active

053977467

ABSTRACT:
An integrated circuit package which contains a heat slug that extends from an integrated circuit to a top surface of a surrounding housing. The heat slug has a coefficient of thermal expansion that matches the coefficients of thermal expansion of the housing and the integrated circuit to reduce thermal stresses in the package.

REFERENCES:
patent: 4965659 (1990-10-01), Sasame et al.
patent: 4994411 (1991-02-01), Naito et al.
patent: 5081067, Shimizu et al.
patent: 5202288 (1993-04-01), Doering et al.
patent: 5216283 (1993-06-01), Lin
patent: 5227662 (1993-07-01), Ohno et al.
patent: 5304843 (1994-04-01), Takubo et al.

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