Solventless UV dryable B-stageable epoxy adhesive

Details Solventless UV dryable B-stageable epoxy adhesive Solventless UV dryable B-stageable epoxy adhesive

1981-09-11

1983-10-25

Briggs, Sr., Wilbert J.

Synthetic resins or natural rubbers -- part of the class 520 ser

Synthetic resins

Mixing of two or more solid polymers; mixing of solid...

20415914, 20415915, 20415918, 428413, C08L 6300, C08L 6302

Patent

active

044120486

ABSTRACT:
Disclosed is a solventless UV dryable B-stageable epoxy adhesive which comprises about 40 to about 70 pbw of a solid thermally curable epoxy having a molecular weight between about 650 and about 4000, a thermal curing agent for the thermally curable epoxy which is stable at room temperature and soluble on the adhesive in an amount of about stoichiometric to about 50% by weight in excess of stoichiometric, up to about 2 pbw of an accelerator for the thermal curing agent which is soluble in the adhesive, about 25 to about 60 pbw of a liquid UV curable resin having a molecular weight of less than about 700 which is either an epoxy, an acrylic, or a mixture thereof and which is a diluent for the thermally curable epoxy, about 1 to about 10 pbw of a UV photoinitiator for the UV curable resin, up to about 20 pbw of a reactive diluent, up to about 5 pbw of a flow control agent, up to about 1 pbw of a surfactant, and up to about 10 pbw of a tri or higher functional epoxy.

REFERENCES:
patent: 3794576 (1974-02-01), Watt
patent: 3936557 (1976-02-01), Watt
patent: 4222835 (1980-09-01), Dixon
patent: 4252592 (1981-02-01), Green
patent: 4252593 (1981-02-01), Green

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