Metal working – Method of mechanical manufacture – Electrical device making
Patent
1986-05-20
1987-06-23
Goldberg, Howard N.
Metal working
Method of mechanical manufacture
Electrical device making
29830, 29832, H05K 330
Patent
active
046741828
ABSTRACT:
A printed wiring board comprising a main printed wiring board provided with a first wiring pattern, and an auxiliary flexible printed wiring board, provided with a second wiring pattern for modifying the first wiring pattern and bonded to the main printed wiring board so as to electrically connect the second wiring pattern to a desired part of the first wiring pattern. The auxiliary board may be affixed to the main board with a pressure-sensitive adhesive or thermosetting adhesive. The auxiliary board may be provided with marks for facilitating alignment, holes to provide access to the main board, a dummy pattern for preventing tears of the flexible auxiliary board, and a second dummy pattern to prevent warping from uneven stresses applied to the flexible auxiliary board by differences in thermal expansion of the auxiliary board and the pattern printed thereon. A method of making the board is also disclosed and claimed.
REFERENCES:
patent: 3683105 (1972-08-01), Shamash et al.
patent: 3712740 (1973-01-01), Hennings
patent: 3795047 (1974-03-01), Abolafia et al.
patent: 3912852 (1975-10-01), Simon
patent: 4338149 (1982-07-01), Quaschner
patent: 4449769 (1984-05-01), Kobayashi et al.
patent: 4495546 (1985-01-01), Nakamura et al.
Arbes Carl J.
Goldberg Howard N.
Kabushiki Kaisha Toshiba
LandOfFree
Method for producing printed wiring board with flexible auxiliar does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with Method for producing printed wiring board with flexible auxiliar, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Method for producing printed wiring board with flexible auxiliar will most certainly appreciate the feedback.
Profile ID: LFUS-PAI-O-713463