Semiconductor product plating apparatus

Details Semiconductor product plating apparatus Semiconductor product plating apparatus

1993-06-09

1995-03-14

Niebling, John

Electrolysis: processes, compositions used therein, and methods

Electrolytic coating

Coating selected area

205128, 205133, C25D 502

Patent

active

053974530

ABSTRACT:
A semiconductor product plating apparatus includes housings having a first mask portion for masking both the surfaces of a resin package of a semiconductor device and a second mask portion for masking the peripheral portion of a lead frame, when clamping a semiconductor product from both surface sides of the lead frame, and hollow portions surrounding outer leads between the semiconductor device and the peripheral portion of the lead frame. Electrolytic solution supply slits and electrolytic solution drainage slits are formed in the housings so as to communicate with the hollow portions. The apparatus also includes electrodes formed on portions of the inner wall surfaces of the hollow portions. The first mask portion has a tapered side surface which widens toward the end. The electrolytic solution supply slits have opening portions formed in a direction to cross the proximal end portions of the outer leads and communicating with the side surface of the first mask portion.

REFERENCES:
patent: 3723283 (1973-03-01), Johnson

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