Epoxy resin coating composition for printed circuit boards

Details Epoxy resin coating composition for printed circuit boards Epoxy resin coating composition for printed circuit boards

1982-07-22

1985-03-12

Briggs, Sr., Wilbert J.

Synthetic resins or natural rubbers -- part of the class 520 ser

Synthetic resins

Processes of preparing a desired or intentional composition...

428901, 523428, 523434, 523437, 523438, 525113, 525504, 525476, 525523, 525524, C08L 6300, C08L 6310

Patent

active

045046077

ABSTRACT:
A resinous protective coating useful in the manufacture of printed circuit boards with circuit patterns having a resolution of at least 0.25 mm lines and spaces thereon. The protective coating comprises resins dissolved in solvents, wherein the coating upon being subjected to heat goes from a high viscosity solution to a gel and then to a solid or from a soft "gel-like" state into a solid. The protective coating is resistant to copper electroplating baths, adheres to insulating substrates, adhesive coated base materials as well as metallic substrates and is capable of withstanding the thermal shock of dip soldering.

REFERENCES:
patent: 3100756 (1963-08-01), Fry
patent: 3519602 (1970-07-01), Castro et al.
patent: 3780132 (1973-12-01), Lohr
patent: 3816364 (1974-06-01), Bayer
patent: 3864426 (1975-02-01), Salensky
patent: 3880868 (1975-05-01), Trice et al.
patent: 3926904 (1975-12-01), Scola
patent: 4240945 (1980-12-01), Gabrick

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