Semiconductor device in a resin package housed in a frame having

Details Semiconductor device in a resin package housed in a frame having Semiconductor device in a resin package housed in a frame having

1994-07-27

1997-04-29

Brown, Peter Toby

Active solid-state devices (e.g., transistors, solid-state diode

Housing or package

Housing or package filled with solid or liquid electrically...

257700, 257706, 257713, 257787, H01L 2308, H01L 2310, H01L 2328, H01L 2334

Patent

active

056252226

ABSTRACT:
A semiconductor device including a substrate, solder bumps provided on a lower major surface of the substrate, a semiconductor chip provided on an upper major surface of the substrate, a resin package body provided on the upper major surface of the substrate so as to bury the semiconductor chip therein, a thermally conductive frame member having a flange part supporting the substrate at a rim part of the substrate, wherein the thermal conductive frame member has a thermal conductivity substantially larger than that of the resin package body and extending along to and in an intimate contact with side walls of the resin package body.

REFERENCES:
patent: 4887148 (1989-12-01), Mu
patent: 5108955 (1992-04-01), Ishida et al.
patent: 5136366 (1992-08-01), Worp et al.
patent: 5227663 (1993-07-01), Patil et al.
patent: 5285352 (1994-02-01), Pastore et al.
patent: 5291062 (1994-03-01), Higgins, III

Affiliated with

Also associated with

Rating

Semiconductor device in a resin package housed in a frame having does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Semiconductor device in a resin package housed in a frame having, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Semiconductor device in a resin package housed in a frame having will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-708390