Method for semiconductor device packaging

Details Method for semiconductor device packaging Method for semiconductor device packaging

1982-10-04

1985-03-12

Lowe, James

Plastic and nonmetallic article shaping or treating: processes

Mechanical shaping or molding to form or reform shaped article

To produce composite, plural part or multilayered article

29588, 264161, 2643285, 2643289, B29C 604

Patent

active

045044350

ABSTRACT:
A method and apparatus for encapsulating a lead frame in a flat metal strip and a semiconductor device attached thereto having a mold receiving the semiconductor device and lead frame into a cavity. The strip has a thoroughfare over a solid surface to adjacent said lead frame. A depression in the mold over a portion of the thoroughfare contains a pellet of plastic. A runner extends from the depression over the thoroughfare to transfer liquid plastic from the depression into the cavity.

REFERENCES:
patent: 4003544 (1977-01-01), Bliven et al.
patent: 4043027 (1977-08-01), Birchler et al.
patent: 4332537 (1982-01-01), Slepcevic

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