Method for packaging an integrated circuit

Details Method for packaging an integrated circuit Method for packaging an integrated circuit

1993-06-29

1995-03-14

Arbes, Carl J.

Metal working

Method of mechanical manufacture

Electrical device making

29827, 29840, 2281801, 437220, H05K 330

Patent

active

053967011

ABSTRACT:
The present invention provides a modular electronic component (10) wherein a sequence of leads (26) of a lead frame (12) differs from a sequence of bonding pads (16) on an integrated circuit (14). When lead frame (12) is placed adjacent integrated circuit (14), first and second power buses (22) and (24) are disposed on a first side (18) of bonding pads (16). First portion (30) of leads (26) and lead finger (28) are disposed on second side (20) of bonding pads (16). Bonding members (42) couple appropriate bonding pads (16) with corresponding leads (26), first and second power buses (22) and (24), and lead finger (28). In this manner, the pin out of modular electronic component (10) may be altered by incorporating appropriate lead fingers (28) without changing the sequence of bonding pads (16).

REFERENCES:
patent: 5156983 (1992-10-01), Schlesinger et al.

Affiliated with

Also associated with

Rating

Method for packaging an integrated circuit does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Method for packaging an integrated circuit, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Method for packaging an integrated circuit will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-706599