Covered wire connection structure

Details Covered wire connection structure Covered wire connection structure

1997-06-03

1999-09-28

Kincaid, Kristine

Electricity: conductors and insulators

Conduits, cables or conductors

Combined

29872, H01R 400

Patent

active

059592524

ABSTRACT:
Two covered wires conductively connected are overlapped with each other at connection portions S. The overlapped connection portions are pinched by a pair of resin chips. Cover portions are melted and the conductive wire portions of both the covered wires are conductively contacted with each other at the connection portions by pressing from outside of the resin chips. Then, the pair of the resin chips are melt-fixed to each other to seal the connection portions. The resin chips are provided with first melting portions which are melt-fixed to a mating chip in area including the connection area to seal the connection portions and second melting portions which are separated from the first melting portions and melt-fixed to the mating chip in area other than the connection portion. Thus, it is possible to achieve reduction of conducting resistance and improvement of mechanical strength.

REFERENCES:
patent: 2250156 (1941-07-01), Ferguson
patent: 3244798 (1966-04-01), Warner
patent: 4878969 (1989-11-01), Janisch
patent: 5584122 (1996-12-01), Kato et al.

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