High molecular weight siloxane polyimides, intermediates therefo

Details High molecular weight siloxane polyimides, intermediates therefo High molecular weight siloxane polyimides, intermediates therefo

1984-08-10

1987-05-26

Kight, John

Synthetic resins or natural rubbers -- part of the class 520 ser

Synthetic resins

From silicon reactant having at least one...

528125, 528128, 528172, 528188, C08G 7310

Patent

active

046687556

ABSTRACT:
High molecular weight siloxane polyamic acids and polyimides are prepared by the reaction of dianhydrides with diamines in a polar aprotic solvent, all of the reagents and solvent being highly purified and substantially anhydrous. The polyamic acids may be coated on substrates and baked to form polyimide dielectric layers. When so used, they are free from certain disadvantages of lower molecular weight polymers, especially undercutting and scum formation during photolithography and etching procedures.

REFERENCES:
patent: 3325450 (1967-06-01), Holub
patent: 3740305 (1973-06-01), Hoback et al.
patent: 4030948 (1977-06-01), Berger
patent: 4520075 (1985-05-01), Igarashi et al.
Duran et al., "Ultrapure Polyimides: Syntheses and Applications", from Davidson, Polymers in Electronics (1984), pp. 239-258.

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