Metal working – Method of mechanical manufacture – Electrical device making
Patent
1998-02-27
1999-09-21
Arbes, Carl J.
Metal working
Method of mechanical manufacture
Electrical device making
29841, 22818022, 438108, H05K 334
Patent
active
059538147
ABSTRACT:
A process and combination of materials for underfilling a surface-mount IC device (12), such as a flip chip, for the purpose of increasing the thermal cycle fatigue life of the terminals (14) that attach the device (12) to a thin-laminate organic circuit board (10), such as a printed wiring board (PWB) or printed circuit board (PCB). The process parameters and materials, including the underfill (20), masking (22) and cleaning materials used, exhibit a synergistic effect that increases thermal cycle fatigue resistance to a level at which a flip chip processed in accordance with this invention is capable of reliably withstanding at least 1000 one-hour cycles between -40.degree. C. and 150.degree. C. The materials and the manner in which the device (12) and circuit board (10) are prepared for application of the materials are critical to eliminating tendencies for inconsistent reliability in underfilled SM devices.
REFERENCES:
patent: 4604644 (1986-08-01), Beckham et al.
patent: 5084961 (1992-02-01), Yoshikawa
patent: 5089440 (1992-02-01), Christie et al.
patent: 5121190 (1992-06-01), Hsiao et al.
patent: 5194930 (1993-03-01), Papathomas et al.
patent: 5274913 (1994-01-01), Grebe et al.
patent: 5400950 (1995-03-01), Myers et al.
patent: 5542601 (1996-08-01), Fallon et al.
patent: 5578525 (1996-11-01), Mizukoshi
patent: 5615477 (1997-04-01), Sweitzer
patent: 5704116 (1998-01-01), Gamota et al.
patent: 5710071 (1998-01-01), Beddingfield et al.
Research Disclosure, Jul. 1993 #35133 UV Light Erasable Flip Chip Packaging Technique.
D.R. Gamota et al., Advanced Encapsulant Materials Systems for Flip-Chip-on-Board Assemblies: I. Encapsulant Materials with Improved Manufacturing Properties II. Materials to Integrate the Reflow and Underfilling Process, IEEE/CPMT Int'l Electronics Manufacturing Technology Symposium (1996), pp. 1-9.
Gibson Michael D.
Mack Susan Acheson
Meehan Michael Patrick
Peugh Darrel Eugene
Rosson James M.
Arbes Carl J.
Delco Electronics Corp.
Funke Jimmy L.
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