Printed circuit boards

Details Printed circuit boards Printed circuit boards

1996-10-07

1999-09-28

Jones, Deborah

Stock material or miscellaneous articles

Structurally defined web or sheet

Discontinuous or differential coating, impregnation or bond

174250, 174252, 174263, 428901, 361748, B32B 300, H05K 100

Patent

active

059585625

ABSTRACT:
On a surface of an insulating board, a front wiring pattern is formed. On the rear surface of the insulating board, opposing the front wiring pattern, a rear wiring pattern is formed in a shape which is substantially plane-symmetrical to the front wiring pattern. An opening which penetrates the front wiring pattern and the rear wiring pattern is formed. At the inner wall of the opening, an electrically conductive layer is formed. Inside the opening, solder, for example, is placed to form an electrically conductive filling. As a result, the front wiring pattern and the rear wiring pattern are positively connected to each other electrically. Therefore, the current capacity and the heat capacity of the wiring patterns are increased, and the amount of generated heat is reduced.

REFERENCES:
patent: 3330695 (1967-07-01), Curran
patent: 3568312 (1971-03-01), Perricone
patent: 3708876 (1973-01-01), Klehm, Jr.
patent: 4826720 (1989-05-01), Wade
patent: 5252383 (1993-10-01), Fukutake et al.
patent: 5283107 (1994-02-01), Bayer et al.
patent: 5288541 (1994-02-01), Blackwell et al.
patent: 5408053 (1995-04-01), Young
Patent Abstracts of Japan, vol. 18, No. 560, Oct. 26, 1994 & JP 6-204628, Jul. 22, 1994.

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