Electric heating – Metal heating – By arc
Patent
1996-03-01
1999-09-28
Mills, Gregory L.
Electric heating
Metal heating
By arc
21912185, 134 1, B23K 2614
Patent
active
059582685
ABSTRACT:
An apparatus and method for selectively removing undesired material from the surface of a substrate provides a flow of inert gas over the undesired material substrate surface while irradiating the undesired material with energetic photons. The invention enables removal of undesired material without altering the physical properties of the material underlying or adjacent the removed, undesired material. Removal effectiveness may be enhanced by utilizing polarized energetic photons. Directing a laser beam to the back side of a transparent substrate may enhance the effectiveness of removal.
REFERENCES:
patent: Re33777 (1991-12-01), Woodroffe
patent: 4368080 (1983-01-01), Langen et al.
patent: 4752455 (1988-06-01), Mayer
patent: 4784135 (1988-11-01), Blum et al.
patent: 4908493 (1990-03-01), Susemihl
patent: 4980536 (1990-12-01), Asch et al.
patent: 4987286 (1991-01-01), Allen
patent: 5023424 (1991-06-01), Vaught
patent: 5024968 (1991-06-01), Engelsberg
patent: 5068750 (1991-11-01), Cook et al.
patent: 5099557 (1992-03-01), Engelsberg
patent: 5114834 (1992-05-01), Nachshon
patent: 5151134 (1992-09-01), Boquillon et al.
patent: 5151135 (1992-09-01), Magee et al.
patent: 5228206 (1993-07-01), Grant et al.
patent: 5373140 (1994-12-01), Nagy et al.
patent: 5482561 (1996-01-01), Yeung et al.
patent: 5499668 (1996-03-01), Katayama et al.
patent: 5531857 (1996-07-01), Engelsberg et al.
patent: 5592879 (1997-01-01), Waizmann
"Damage-free Laser Ablation Removal of Organic Materials," IBM Technical Disclosure Bulletin, vol. 37, No. 10, p. 453, Oct. 1994.
Tanabe, et al., "Polarization Dependence of Electric Field Intensity Distributions in Photoresist Films," Jpn. J. Appl. Phys. vol. 33, Pt 1, No. 128, 1994.
von Allmen, et al., "Absorption of Laser Light," von Allmen, M., et al., Laser-Beam Interactions with Materials, 2nd ed., Springer, 1995, pp. 5-17.
Grill, W., et al, "Excitation of Coherent and Incoherent Terahertz Phonon Pulses in Quartz Using Infrared Laser Radiation," Physical Review Letters, vol. 35, No. 9, pp. 588-591, Sep. 1, 1975.
Vig, J., "UV/Ozone Cleaning of Surfaces," J. Vac. Sci. Technol. A, vol. 3, No. 3, pp. 1027-1034, May/Jun. 1985.
Dulcey, C., et al., "Deep UV Photochemistry of Chemisorbed Monolayers: Patterned Coplanar Molecular Assemblies," Science, vol. 252, Reports, pp. 551-554, Apr. 26, 1991.
Van Eck, B., et al., "Vapor Phase Etching and Cleaning of SiO.sub.2," Microcontamination Conference Proceedings, pp. 694-705.
deLarios, J., et al., "Gas-Phase Cleaning of Trace Metal and Organic Contaminants From Wafers: Ultraviolet Irradiated Oxygen-Based and Chlorine-Based Chemistries,"Microcontamination Conference Proceedings, pp. 706-717.
Miyashita, M., et al., "Dependence of Surface Microroughness of CZ, FZ, and EPI Wafers on Wet Chemical Processing," J. Electrochem. Soc., vol. 139, No. 8, pp. 2,133-2,142, Aug. 1992.
McClelland, J., "Laser-Focused Atomic Deposition," Science, vol. 262, pp. 877-880, Nov. 5, 1993.
Bryzek, J., et al., "Micromachines on the March," IEEE Spectrum, pp. 20-31, May 1994.
Weis, O., "Surface Excitation of Hypersound in Piezoelectric Crystals by Plane Electromagnetic Waves," Z. Physik, B 21, Nos. 1-10, Feb. 14, 1975.
Engelsberg, A., "Particle Removal from Semiconductor Surfaces Using a Photon-Assisted, Gas-Phase Cleaning Process," Materials Research Society Symposium Proceedings, vol. 315, pp. 254-260, 1993.
Burggraaf, P., "Thin Film Metrology: Headed for a New Plateau," Semiconductor International, pp. 56-60, Mar. 1994.
Barna, G., et al., "Dry Etch Processes and Sensors," Solid State Technology, pp. 47-53, Jan. 1994.
Ohmi, T., "ULSI Reliability Through Ultraclean Processing," Proceedings of the IEEE, vol. 81, No. 5, pp. 716-729, May 1993.
Lu, Y., et al., "Laser Cleaning -A New Surface Cleaning Method Without Pollutions," Mat. Res. Soc. Symp. Proc., vol. 334, pp. 329-334, 1994.
Lu, Y., et al., "Laser-Induced Dry Cleaning in Air --A New Surface Cleaning Technology in Lieu of Carbon Fluorochloride (CFC) Solvents," Jpn. J. Appl. Phys., vol. 33, Part 2, No. 3B, pp. L430-L433, Mar. 15, 1994.
Lu, Y., et al., "Laser-Induced Removal of Fingerprints From Glass and Quartz Surfaces," Jpn. J. Appl. Phy., vol. 33, Pt. 1, No. 8, pp. 4,691-4696, 1994.
Lu, Y., et al., "Excimer-Laser Removal of SiO.sub.2 Patterns From GaAs Substrates," Jpn. J. Appl. Phys. Letters, vol. 33, Pt. 2, No. 3A, pp. L324-L327, Mar. 1, 1994.
Bollinger, L., et al., "Plasma Process Integration for Large Wafer Manufacturing,"Advanced Semiconductor Manufacturing Conference, Nov. 14, 1994.
Lu, Y., et al., "Laser Surface Cleaning in Air: Mechanisms and Applications," Jpn. J. Appl. Phys., vol. 33, Pt. 1, No. 12B, pp. 7138-7143, Dec. 1994.
Shen, Y., Laser Manipulation of Particles, The Principles of Nonlinear Optics, Chap. 20, pp. 366-378, 1984.
Magee, T., et al., "Technology Disclosure: UV Laser Cleaning of Semiconductor Surfaces," XMR Inc., Santa Clara, CA. No date available.
Engelsberg, A., "Laser-Assisted Cleaning Proves Promising," Precision Cleaning, Reprint, May 1995.
Lu, Y., et al., "Excimer Laser Applications in Integrated Circuit Packaging," to be published in Proceedings Of The Materials Research Soc., vol. 397, Spring, 1996.
Lu, Y., et al., "Laser Dry Cleaning of ZrO.sub.2 Particles From Air Bearing Surface of Magnetic Head Sliders," to be published in Proceedings Of The Materials Research Soc., vol. 397, Spring, 1996.
Engelsberg Audrey C.
Parker William P.
Cauldron Limited Partnership
Goodell Robert J.
Mills Gregory L.
Talbot C. Scott
LandOfFree
Removal of material by polarized radiation does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with Removal of material by polarized radiation, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Removal of material by polarized radiation will most certainly appreciate the feedback.
Profile ID: LFUS-PAI-O-699334