Multi-function heat dissipator

Details Multi-function heat dissipator Multi-function heat dissipator

1996-09-26

1998-09-29

Picard, Leo P.

Electricity: electrical systems and devices

Housing or mounting assemblies with diverse electrical...

For electronic systems and devices

361688, 361690, 361703, 361707, 361709, 361711, 361719, 361720, 165 803, 165185, 257718, 257719, 257722, H05K 720

Patent

active

058153713

ABSTRACT:
A method and apparatus simultaneously supporting a circuit board and dissipating heat from an electrical device on the circuit board. In a computer including the circuit board and a mother board connected to the circuit board, a heat dissipator not only dissipates any heat produced by the electrical device, but also secures the circuit board to the mother board. The heat dissipator includes three frame plates and two support plates, each made of a thermally conductive material. The first frame plate is directly connected to the electrical device. The first and second frame plates are proximate to and parallel with the front and back faces of the circuit board, respectively and the third frame plate connects the first and second frame plates. The first and second support plates attach the first and second frame plates, respectively, to the mother board.

REFERENCES:
patent: 3180404 (1965-04-01), Nelson et al.
patent: 4277816 (1981-07-01), Dunn et al.
patent: 4441140 (1984-04-01), Richard
patent: 4463569 (1984-08-01), McLarty
patent: 4489363 (1984-12-01), Goldberg
patent: 4607685 (1986-08-01), Mitchell, Jr.
patent: 4631641 (1986-12-01), Brombal et al.
patent: 4669028 (1987-05-01), Faa, Jr.
patent: 4675783 (1987-06-01), Murase et al.
patent: 4953634 (1990-09-01), Nelson et al.
patent: 5002123 (1991-03-01), Nelson et al.
patent: 5109318 (1992-04-01), Funari et al.
patent: 5184281 (1993-02-01), Samarov et al.
patent: 5381314 (1995-01-01), Rudy, Jr. et al.
IBM Technical Disclosure Bulletin authored by R.E. Simons, entitled Micro-Modular Air-Cooling Scoop, dated Jun. 1979, pp. 240-241.
1997 Intel Corporation Bulletin entitled, Pentium II Processor.

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