Method, apparatus and system for analyzing failure of measured d

Details Method, apparatus and system for analyzing failure of measured d Method, apparatus and system for analyzing failure of measured d

1997-01-02

2000-02-29

Teska, Kevin J.

Radiant energy

Ionic separation or analysis

Static field-type ion path-bending selecting means

2504922, G01N 2166

Patent

active

060319852

ABSTRACT:
A method for analyzing failures and an apparatus for analyzing failures are provided in which failed portions can easily be specified with high precision in a short time by using an emission analyzing apparatus without analyzers depending on designers. The coordinates of an emitting portion on an emission image which is detected by an emission analyzing apparatus are automatically recognized (Step S5). The same coordinates are automatically converted into the coordinates on a layout pattern (data) (Step S7). An emitting portion on a layout pattern is automatically displayed (Step S11). The name of a node on a net list (data) of the emitting portion is automatically recognized according to the coordinates on the layout pattern (Step S12). The name of an emitting node is automatically displayed on a net list (Step S13). Furthermore, an emitting node on a circuit diagram (data) is automatically displayed as an emitting portion on a circuit diagram based on the emitting node name (Step S15).

REFERENCES:
patent: 5175495 (1992-12-01), Brahme et al.
patent: 5391885 (1995-02-01), Imataki et al.
patent: 5661520 (1997-08-01), Bruce
Stefano Concina, et al., Elekrtonik, vol. 15, pp. 47-56, "Rechnergestutzter E-Beam-Chiptest", Jul. 24, 1997.

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