Composition, plating bath, and method for electroplating tin and

Details Composition, plating bath, and method for electroplating tin and Composition, plating bath, and method for electroplating tin and

1978-04-05

1979-02-13

Kaplan, G. L.

Chemistry: electrical and wave energy

Processes and products

204 53, 204 54R, 204DIG2, 544406, 544410, 548335, 548341, 548343, C25D 332, C25D 336, C25D 360, C07D20700

Patent

active

041394259

ABSTRACT:
A composition is described which is useful particularly in improving the electrodeposition of tin, lead or tin-lead from an aqueous acidic plating bath. The new composition comprises a reaction product of an unsaturated nitrogen-containing heterocyclic compound with a mixture comprising formaldehyde and an unsaturated aliphatic aldehyde containing up to about six carbon atoms. Aqueous acidic plating baths containing the additive compositions of the invention, and methods for depositing tin, lead or tin-lead alloys from such baths as well as additive compositions for forming the baths also are described.

REFERENCES:
patent: 3361652 (1968-01-01), Korpiun et al.
patent: 3850765 (1974-11-01), Karustis et al.

Affiliated with

Also associated with

Rating

Composition, plating bath, and method for electroplating tin and does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Composition, plating bath, and method for electroplating tin and, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Composition, plating bath, and method for electroplating tin and will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-689888