Microelectronic element bonding with deformation of leads in row

Details Microelectronic element bonding with deformation of leads in row Microelectronic element bonding with deformation of leads in row

1996-07-12

1998-11-03

Niebling, John

Semiconductor device manufacturing: process

Packaging or treatment of packaged semiconductor

Metallic housing or support

438125, H01L 2160

Patent

active

058307826

ABSTRACT:
A method of making a microelectronic assembly includes bonding a plurality of lead connection sections arranged in a row to contacts of a microelectronic element such as a semiconductor chip having contacts in rows at the periphery of the chip. The leads have terminal sections secured to a dielectric support structure, and horizontally curved sections between the terminal regions and bond regions. After bonding, the dielectric support structure is lifted upwardly relative to the chip, so as to bend the leads into a vertically-extensive orientation. Partial straightening of the original horizontal curvature allows each lead to stretch and accommodate the vertical movement.

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