Electricity: electrical systems and devices – Safety and protection of systems and devices – With specific current responsive fault sensor
Patent
1985-01-29
1987-06-16
Wojciechowicz, Edward J.
Electricity: electrical systems and devices
Safety and protection of systems and devices
With specific current responsive fault sensor
357 71, 361403, 361405, 174 52FP, 29827, 29840, H01L 2348
Patent
active
046739670
ABSTRACT:
An improved surface mounted system for leaded semiconductor devices has J-shaped device leads soldered to respective portions of circuit pads on a printed circuit board, each lead having inner and outer surfaces of the J-shape covered with solder dewetting and solder wetting metals respectively which are metallurgically bonded to a metal core of the lead formed of a springy, relatively high electrical conductivity metal. The short leg of each J-shaped lead is curved and the outer, solder wettable surface of that curved lead part is soldered to a selected circuit pad portion, preferably by use of a pad or solder paste deposited on the circuit pad portion, while other surfaces of the lead are maintained substantially free of solder for avoiding solder bridging between leads and for assuring that an adequate amount of solder is retained between the curved lead part and the desired circuit pad portion to provide secure electrical connection to the printed circuit and secure surface mounting of the device on the circuit board.
REFERENCES:
patent: 3942245 (1976-03-01), Jackson et al.
patent: 4141029 (1979-02-01), Dromsky
patent: 4147889 (1979-04-01), Andrews et al.
Haug John A.
McAndrews James P.
Sharp Melvin
Texas Instruments Incorporated
Wojciechowicz Edward J.
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