Semiconductor device having resin encapsulated package structure

Details Semiconductor device having resin encapsulated package structure Semiconductor device having resin encapsulated package structure

1998-06-16

2000-02-29

Kelley, Nathan K.

Active solid-state devices (e.g., transistors, solid-state diode

Housing or package

With contact or lead

257690, 257693, H01L 2348

Patent

active

060312807

ABSTRACT:
A semiconductor device includes a substrate having a first surface, a second surface and at least one conductor part which are exposed at both the first and second surfaces of the substrate, a semiconductor chip provided on the first surface of the substrate and having a plurality of electrode pads, a plurality of leads, a plurality of bonding-wires electrically connecting the leads and the conductor parts to corresponding ones of the electrode pads of the semiconductor chip, and a resin package encapsulating the semiconductor chip, a part of the leads, and the substrate so that the conductor parts are exposed at the second surface of the substrate.

REFERENCES:
patent: 4742385 (1988-05-01), Kohmoto
patent: 5097319 (1992-03-01), Satriano
patent: 5162896 (1992-11-01), Takubo et al.
patent: 5225709 (1993-07-01), Nishiuma et al.
patent: 5250841 (1993-10-01), Sloan et al.
IBM Technical Disclosure Bulletin; vol. 33, No. 2, Jul. 1990.

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