Fluidized bed heater for semiconductor processing

Electric heating – Heating devices – Combined with container – enclosure – or support for material...

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Details

118724, 118725, C23C 1648, C23C 1644

Patent

active

046737995

ABSTRACT:
A fluidized bed heater for uniformly raising the surface temperature of semiconductor wafers. The heater includes a mantle having at least one planar surface for supporting wafers, a bed of particles adjacent the mantle which is fluidized by passing a gas through the particle bed, and a bed heater which heats the bed particles to a uniform temperature so that wafers supported on the planar surface are heated to a uniform temperature. A reactor is also described which contains a reactor chamber for processing semiconductor wafers and a fluidized bed heater for uniformly heating semiconductor wafers in the reactor chamber.

REFERENCES:
patent: 3608519 (1971-09-01), Bean
patent: 3918396 (1975-11-01), Dietze et al.
patent: 4096909 (1978-06-01), Jukkola
patent: 4299562 (1981-11-01), Harman
patent: 4343352 (1982-08-01), Bockman et al.
patent: 4419332 (1983-12-01), von der Ropp
patent: 4522149 (1985-06-01), Garbis et al.

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