Functional chip to be used while stacked on another chip and sta

Details Functional chip to be used while stacked on another chip and sta Functional chip to be used while stacked on another chip and sta

1994-02-17

1995-04-18

Limanek, Robert P.

Active solid-state devices (e.g., transistors, solid-state diode

Integrated circuit structure with electrically isolated...

Passive components in ics

257777, H01L 2328

Patent

active

054081238

ABSTRACT:
A functional chip and a stack structure of such functional chips that enables high mounting density to be readily achieved. The functional chip has a functional element, such as a semiconductor element including an integrated circuit on a substrate, first and second insulating films respectively on first and second opposed surfaces of the functional element, and first and second magnetic films respectively on the first and second insulating films. The first and second magnetic films are divided into regions and magnetized such as to have magnetic poles arranged in a prescribed pattern. A plurality of such functional chips are stacked on each other to form the stack structure. Among the functional chips in the stack structure, adjacent functional chips are stacked on each other in such a manner that the first magnetic film of one of the pair of functional chips is held to the second magnetic film of the other functional chip by magnetic force. For this purpose, that first magnetic film and that second magnetic film may have magnetic poles of unlike polarities at corresponding positions of the films.

REFERENCES:
patent: 4894706 (1990-01-01), Sato et al.
patent: 5157576 (1992-10-01), Takaya

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