Socket assembly for integrated circuit chip carrier package

Details Socket assembly for integrated circuit chip carrier package Socket assembly for integrated circuit chip carrier package

1996-11-14

1998-11-03

Abrams, Neil

Electrical connectors

Preformed panel circuit arrangement, e.g., pcb, icm, dip,...

With provision to conduct electricity from panel circuit to...

439331, H01R 909, H05K 100

Patent

active

058299882

ABSTRACT:
A socket for a ball grid array chip carrier package containing a die which is electrically interconnected. Individual spring elements in the socket are utilized for interconnecting each ball of the ball grid array. The individual spring elements provide upward pressure against individual sections of a substrate in direct contact with the balls of the ball grid array. The individual sections of the substrate are formed into individual beam members that are permitted to flex in response to pressure from the underlying spring elements.

REFERENCES:
patent: 3975072 (1976-08-01), Ammon
patent: 4220393 (1980-09-01), Ammon et al.
patent: 4804132 (1989-02-01), DiFrancesco
patent: 5068062 (1991-11-01), Imata et al.
patent: 5073117 (1991-12-01), Malhi et al.
patent: 5083697 (1992-01-01), DiFrancesco
patent: 5151040 (1992-09-01), Tanaka
patent: 5194695 (1993-03-01), Maslakow
patent: 5205743 (1993-04-01), Goff et al.
patent: 5232372 (1993-08-01), Bradley et al.
patent: 5241133 (1993-08-01), Mullen, III et al.
patent: 5395254 (1995-03-01), Mogi
patent: 5471011 (1995-11-01), Maslakow
patent: 5475317 (1995-12-01), Smith
patent: 5483740 (1996-01-01), Maslakow
patent: 5561594 (1996-10-01), Wakefield
patent: 5628636 (1997-05-01), Ollivier
"MCC Workshop Overview/Summary," Internal Memorandum by Bill Maslakow, Amkor Electronics LPD, Feb. 7, 1996.
"Solving the Interconnect Puzzle," IBM Technology Products Endicott Electronic Package, Cable and Connector Products, IBM, undated.
"Particle Interconnect: A New Interconnect Technology," DiFrancesco, Larry, Proceedings of the Surface Mount International Conference, MCM-L Interconnection Technology, Aug. 1993 (reprint).

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