Electroless plating solution

Details Electroless plating solution Electroless plating solution

1997-09-08

1999-04-27

Klemanski, Helene

Compositions: coating or plastic

Coating or plastic compositions

Metal-depositing composition or substrate-sensitizing...

106 123, 106 125, 106 127, C23C 1834

Patent

active

058976922

ABSTRACT:
An electroless plating solution having high stability and capable of preventing the formation of nodules is disclosed. The electroless plating solution includes metal ions which includes nickel ions and copper and/or cobalt ions, a complexing agent containing a hydroxycarboxylic acid and a reducing agent and having a pH of at least 7, and an anionic surfactant. The electroless plating solution further includes iron ions provided by a source selected from potassium ferrocyanide and potassium ferricyanide. The completing agent is preferably used in a molar amount at least equal to that of the metal ions. The electroless plating solution is preferred to contain from 1 mg/L to 0.2 g/L of iron ions and from 10 ppm to 10 g/L of the anionic surfactant.

REFERENCES:
patent: T965005 (1977-12-01), Leone et al.
patent: 3716462 (1973-02-01), Jensen
patent: 3717482 (1973-02-01), Gulla et al.
patent: 4080207 (1978-03-01), Leone et al.
patent: 4303443 (1981-12-01), Miyazawa et al.
patent: 5269838 (1993-12-01), Inoue et al.
patent: 5753304 (1998-05-01), Tung
Dialog abstract of JP02/301591, Dec. 1990.

Affiliated with

Also associated with

Rating

Electroless plating solution does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Electroless plating solution, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Electroless plating solution will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-683530