Method and device for carrying out the cleavage in ultra-high va

Details Method and device for carrying out the cleavage in ultra-high va Method and device for carrying out the cleavage in ultra-high va

1996-05-08

1998-11-03

Jones, Eugenia

Severing by tearing or breaking

Methods

225 2, 225 965, 225103, 125 2301, 438 33, B26F 300, H01L 21301

Patent

active

058296581

ABSTRACT:
A method and a device are provided for obtaining semiconductor bars for laser devices starting from portions of a processed wafer and carrying out the cleavage in ultra-high-vacuum. The cleavage mechanical stresses are impulsive forces and are all applied from the processed side of the wafer through a lowerable shaped member actuated by compressed helical springs, which applies these stresses on the ledging parts of the wafer portion held on a central region thereof by a fixed support and held down in position by a suitably shaped centering thrust member. The spring-up occurs by translating the device in the ultra-high-vacuum environment and opposing a locking lever engaging the lowerable member in an upper or first position with a fixed cam.

REFERENCES:
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patent: 4248369 (1981-02-01), Clausen
patent: 5042352 (1991-08-01), Lux
patent: 5154333 (1992-10-01), Bauer et al.
"Vacuum Compatible Laser Bar Cleaver", IBM Technical Disclosure Bulletin, vol. 36, No. 06A, Jun. 1993, pp. 229-230.
Patent Abstracts of Japan No. JP1166593 Jun. 30, 1989 and Japanese Patent Application JP 870326453 Dec. 22, 1987.
Patent Abstracts of Japan JP 4348909 Dec. 03, 1992 and Japanese Patent Application JP 910029044 Jan. 31, 1991.

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